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| IPG20N06S2L-65 OptiMOS(R) Power-Transistor Product Summary V DS R DS(on),max3) ID 55 65 20 V m A Features * Dual N-channel Logic Level - Enhancement mode * AEC Q101 qualified * MSL1 up to 260C peak reflow * 175C operating temperature * Green Product (RoHS compliant) * 100% Avalanche tested PG-TDSON-8-4 Type IPG20N06S2L-65 Package PG-TDSON-8-4 Marking 2N06L65 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current one channel active1) Symbol ID Conditions T C=25 C, V GS=10 V Value Unit A 20 T C=100 C, V GS=10 V Pulsed drain current1) one channel active Avalanche energy, single pulse1, 3) Avalanche current, single pulse3) Gate source voltage Power dissipation one channel active Operating and storage temperature IEC climatic category; DIN IEC 68-1 14 I D,pulse E AS I AS V GS P tot T j, T stg - I D=10A T C=25 C - 80 40 15 20 43 -55 ... +175 55/175/56 mJ A V W C Rev. 1.0 page 1 2009-09-07 IPG20N06S2L-65 Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics1) Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area2) Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current3) V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=14 A V DS=55 V, V GS=0 V, T j=25 C V DS=55 V, V GS=0 V, T j=125 C2) Gate-source leakage current3) Drain-source on-state resistance3) I GSS R DS(on) V GS=20 V, V DS=0 V V GS=4.5 V, I D=7.5A V GS=10 V, I D=15A 55 1.2 1.6 0.01 2.0 1 A V 100 60 3.5 K/W - 1 1 67 53 100 100 79 65 nA m Rev. 1.0 page 2 2009-09-07 IPG20N06S2L-65 Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics1) Input capacitance3) Output capacitance3) Reverse transfer capacitance3) Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics1, 3) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current1) one channel active Diode pulse current one channel active 1) C iss C oss Crss t d(on) tr t d(off) tf V DD=27.5 V, V GS=10 V, I D=20 A, R G=11 V GS=0 V, V DS=25 V, f =1 MHz - 315 90 35 2 3 10 7 410 120 50 - pF ns Q gs Q gd Qg V plateau V DD=44 V, I D=20 A, V GS=0 to 10 V - 1.2 3.5 9.4 3.9 1.6 5.3 12 - nC V IS T C=25 C I S,pulse V GS=0 V, I F=15 A, T j=25 C V R=27.5 V, I F=I S, di F/dt =100 A/s - - 20 A - - 80 Diode forward voltage V SD - 1.0 1.3 V Reverse recovery time1) t rr - 30 - ns Reverse recovery charge1, 3) Q rr - 28 - nC 1) 2) Specified by design. Not subject to production test. Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 3) Per channel Rev. 1.0 page 3 2009-09-07 IPG20N06S2L-65 1 Power dissipation P tot = f(T C); V GS 6 V; one channel active 2 Drain current I D = f(T C); V GS 6 V; one channel active 45 40 35 30 25 20 15 P tot [W] 20 15 10 5 0 0 50 100 150 200 I D [A] 10 5 0 0 50 100 150 200 25 T C [C] T C [C] 3 Safe operating area I D=f(V DS); T C=25C; D =0; one channel active parameter: t p 100 1 s 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 101 10 s 0.5 100 Z thJC [K/W] I D [A] 0.1 0.05 10 100 s 10-1 0.01 1 ms single pulse 1 1 10 100 10-2 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 1.0 page 4 2009-09-07 IPG20N06S2L-65 5 Typ. output characteristics3) I D = f(V DS); T j = 25 C parameter: V GS 80 10 V 6 Typ. drain-source on-state resistance3) R DS(on) = f(I D); T j = 25 C parameter: V GS 160 3.5 V 4V 4.5 V 5V 5.5 V 140 60 120 5V R DS(on) [m] I D [A] 40 4.5 V 100 80 20 4V 60 3.5 V 3V 10 V 0 0 1 2 3 4 5 40 0 20 40 60 80 V DS [V] I D [A] 7 Typ. transfer characteristics3) I D = f(V GS); V DS = 6V parameter: T j 80 -55 C 25 C 8 Typ. drain-source on-state resistance3) R DS(on) = f(T j); I D = 15 A; V GS = 10 V 120 100 60 R DS(on) [m] 7 80 I D [A] 175 C 40 60 20 40 0 1 2 3 4 5 6 20 -60 -20 20 60 100 140 180 V GS [V] T j [C] Rev. 1.0 page 5 2009-09-07 IPG20N06S2L-65 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 2.5 10 Typ. Capacitances3) C = f(V DS); V GS = 0 V; f = 1 MHz 104 2 103 140A V GS(th) [V] 1.5 14A C [pF] Ciss 1 102 Coss 0.5 Crss 0 -60 -20 20 60 100 140 180 101 0 5 10 15 20 25 30 T j [C] V DS [V] 11 Typical forward diode characteristicis3) IF = f(VSD) parameter: T j 102 12 Avalanche characteristics3) I A S= f(t AV) parameter: T j(start) 100 10 25 C 101 I AV [A] I F [A] 100 C 175 C 25 C 1 150 C 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0.1 1 10 100 1000 V SD [V] t AV [s] Rev. 1.0 page 6 2009-09-07 IPG20N06S2L-65 13 Avalanche energy3) E AS = f(T j) parameter: I D 100 14 Drain-source breakdown voltage V BR(DSS) = f(T j); I D = 1 mA 65 80 5A 62 V BR(DSS) [V] 10 A 15 A 60 59 E AS [mJ] 40 56 20 53 0 25 50 75 100 125 150 175 50 -60 -20 20 60 100 140 180 T j [C] T j [C] 15 Typ. gate charge3) V GS = f(Q gate); I D = 20 A pulsed parameter: V DD 12 16 Gate charge waveforms V GS 11 V 44 V 10 Qg 8 V GS [V] 6 V g s(th) 4 2 Q g (th) Q gs 0 2 4 6 8 10 Q sw Q gd Q gate 0 Q gate [nC] Rev. 1.0 page 7 2009-09-07 IPG20N06S2L-65 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 2009 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 2009-09-07 IPG20N06S2L-65 Revision History Version Date Changes Revision 1.0 07.09.2009 Final Data Sheet Rev. 1.0 page 9 2009-09-07 |
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